Advances in Chemical Mechanical Planarization (CMP) [electronic resource]

• Tác giả: Suryadevara Babu
• Ngôn ngữ: eng
• ISBN-10: 0081001657
• ISBN-13: 978-0081001653
• Ký hiệu phân loại: 621.38152 Electrical, magnetic, optical, communications, computer engineering; electronics, lighting
• Thông tin xuất bản: Oxford : Saint Louis : Woodhead Publishing Limited [Imprint] Elsevier Science & Technology Elsevier Science & Technology Books [Distributor] 2016
• Mô tả vật lý: 536 p. , 09.000 x 06.000 in.
• Bộ sưu tập: Khoa học ứng dụng
• ID: 107789

Tóm tắt

Annotation This text provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink.