Semiconductor Packaging : Materials Interaction and Reliability

• Tác giả: Andrea Chen, Randy Hsiao-Yu Lo
• Ngôn ngữ: eng
• ISBN-13: 978-1439862070
• Ký hiệu phân loại: 621.38152 Electrical, magnetic, optical, communications, computer engineering; electronics, lighting
• Thông tin xuất bản: Boca Raton, FL : Taylor & Francis, 2012
• Mô tả vật lý: 1 electronic resource (216 p.)
• Bộ sưu tập: Tài liệu truy cập mở
• ID: 181702
• Chủ đề: 1. Circuits & components; 2. Electronics engineering; 3. Materials science

Tóm tắt

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.