High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

• Tác giả: Sofie Burger
• Ngôn ngữ: eng
• ISBN-13: 978-3731500254
• ISBN: KSP/1000034759
• Ký hiệu phân loại: 620 Engineering and allied operations
• Thông tin xuất bản: Karlsruhe : KIT Scientific Publishing, 2013
• Mô tả vật lý: 1 electronic resource (XII, 140 p. p.)
• Bộ sưu tập: Tài liệu truy cập mở
• ID: 228951

Tóm tắt

In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.