MEMS Packaging Technologies and 3D Integration

• Tác giả: Seonho Seok
• Ngôn ngữ: eng
• ISBN-13: 978-3036542577
• Thông tin xuất bản: Basel, Switzerland : MDPI - Multidisciplinary Digital Publishing Institute, 2022
• Mô tả vật lý: 1 electronic resource (210 p.)
• Bộ sưu tập: Tài liệu truy cập mở
• ID: 249964
• Chủ đề: 1. Biology, life sciences; 2. Research & information: general

Tóm tắt

 This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow
  three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.