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Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation) [electronic resource]
Tác giả:
Xuất bản: Washington DC Oak Ridge Tenn: United States Dept of Energy Office of Energy Efficiency and Renewable Energy Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2010
Bộ sưu tập: Metadata
ddc:  628.2
 
Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation) [electronic resource]
Tác giả:
Xuất bản: Washington DC Oak Ridge Tenn: United States Dept of Energy Office of Energy Efficiency and Renewable Energy Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2010
Bộ sưu tập: Metadata
ddc:  629.2
 
Electric Vehicles Could Benefit from 50% Improvements in Packaging Thermal Resistance (Fact Sheet) [electronic resource]
Tác giả:
Xuất bản: Washington DC Oak Ridge Tenn: United States Dept of Energy Office of Energy Efficiency and Renewable Energy Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2011
Bộ sưu tập: Metadata
ddc:  621.42
 
Advanced Manufacturing for Thermal and Environmental Control Systems [electronic resource] : Achieving National Energy Goals
Tác giả:
Xuất bản: Washington DC Oak Ridge Tenn: United States Dept of Energy Office of Energy Efficiency and Renewable Energy Distributed by the Office of Scientific and Technical Information US Dept of Energy, 2017
Bộ sưu tập: Metadata
ddc:  658.2
 
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